Capability
- Categories:Capability
- Time of issue:2021-04-13 10:14:41
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Description:
Information
Item(PTH) | Capability |
Max Layer | 36L |
Max finished PCB size | 1200*572mm |
Max PCB thickness | 6mm |
Max copper thickness | 6oz |
Solder mask alignment | +/-1.5mil |
Max aspect ratio | 20:1 |
Min mechanical hole size | 0.15mm |
PTH tolerance / Press-fit hole tolerance / NPTH tolerance | +/-0.0762mm/ +/-0.05mm / +/-0.05mm |
Min drilling tolerance | +/-2mil |
Min trace width / spacing | 2.0/2.0mil |
Min BGA diameter | 8mil |
Impendence control | ≥50Ω+/-7%,<50Ω+/-3% |
Item(HDI) | Capability |
Stack-up | 3+N+3 |
Min hole size | 0.075mm |
Max PCB thickness | 3mm |
Min PCB thickness | 0.35mm |
Blind & burry hole | 0.1mm |
Max aspect ratio | 1:1 |
BGA pitch | 13.7mil |
HDI + Half Via | 2.5/2.5mil |
Copper filling dimple size | ≤0.3mil |
Min track width / spacing | 2.0/2.0mil |
Min BGA tolerance | 8mil |
Impendence control | ≥50Ω+/-7%,<50Ω+/-3% |
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