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Capability

Capability

  • Categories:Capability
  • Time of issue:2021-04-13 10:14:41
  • Views:0
Description:
Description:
Information
Item(PTH) Capability
Max Layer 36L
Max finished PCB size 1200*572mm
Max PCB thickness 6mm
Max copper thickness 6oz
Solder mask alignment +/-1.5mil
Max aspect ratio 20:1
Min mechanical hole size 0.15mm
PTH tolerance / Press-fit hole tolerance / NPTH tolerance +/-0.0762mm/ +/-0.05mm / +/-0.05mm
Min drilling tolerance +/-2mil
Min trace width / spacing 2.0/2.0mil
Min BGA diameter 8mil
Impendence control ≥50Ω+/-7%,<50Ω+/-3%
Item(HDI) Capability
Stack-up 3+N+3
Min hole size 0.075mm
Max PCB thickness 3mm
Min PCB thickness 0.35mm
Blind & burry hole 0.1mm
Max aspect ratio 1:1
BGA pitch 13.7mil
HDI + Half Via 2.5/2.5mil
Copper filling dimple size ≤0.3mil
Min track width / spacing 2.0/2.0mil
Min BGA tolerance 8mil
Impendence control ≥50Ω+/-7%,<50Ω+/-3%

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