CMP
Copper substrate
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  • Copper substrate

Copper substrate


Classification:

Effective heat sink solutions for thermal applications.


INQUIRY

Effective heat sink solutions for thermal applications. This construction type enables superior heat dissipation through use of either aluminium or copper substrate bonded to the insulated circuitry through thermal pre-preg or resin systems. our products are applied to to industrial of automotive, medical, aerospace, lighting and industrial controls. IMS PCB market share is growing rapidly and our production is increasing monthly.

Keyword:

Rigid printed circuit board

Flexible printed circuit board

Flex-rigid printed circuit board

HDI (High density interconnection)

High Frequency printed circuit board

Insulated Metal Base printed circuit board

Related Products

Copper substrate

Effective heat sink solutions for thermal applications.

High-frequency PCB

These circuits have a specific degree of construction complexity where

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